Toshiba Corp has announced plans to expand their state-of-the-art semiconductor facility at Yokkaichi in Mie Prefecture. Construction at the Fab 5 NAND flash memory chip factory will start by August this year and is expected to finish by the summer of 2014. However, the decision on what equipment to invest in and the quantity that they will produce will be dependent on market trends by the time the expansion finishes.
Currently, Toshiba has three fabrication facilities mass producing the NAND flash memory including Phase I of the Fab 5 which went operational in July 2011. The company observed the supply and demand needs of the market and since the demand for smartphones, tablets, SSD for enterprise servers and other new applications has been recovering and increasing, they decided to go ahead with Phase II. They will also be producing 3D memories since they expect a growing demand for applications for the said product. The company will be investing around 300 million dollars for this expansion phase.
Toshiba’s incoming president Hisao Tanaka noted that aside from the increased demand, the weaker yen has also allowed them to seriously compete with rival Samsung Electronics. They will be expanding towards a new generation of memory products in the next few years while also looking at investment opportunities to further boost its competitiveness.
[ via Reuters ]